
Sales Rank :
Seller : Cooler Master
Sale Price:


- Features
- The TPC 812 uses 2 separate cooling technologies to transfer heat - heatpipes and vertical vapor chambers
- Ready for overclocking, benchmarking and silent cooling
- The first ever CPU heatsink to use vertical vapor chamber technology
- 100% pure polished copper base - combined with improved soldering technologies for the best thermal transfer
- Special fin design - heatsink receives concentrated cold airflow
- Compatible CPU Sockets - Intel: LGA 2011/1366/1156/1155/775 and AMD: FM1/FM2/AM3+/AM3/AM2+/AM2
- Improved air pressure design and fan mounting system
Product Description
The first ever CPU heatsink to utilize vertical vapor chamber cooling and combine it with heatpipe technology, TPC 812 is prepared to handle the massive heat generated by overclocking and benchmarking. Vertical vapor chamber working in tandem with heatpipes and a specialized heatsink and fin design allow the TPC 812 to outperform the competition.
The first ever CPU heatsink to utilize vertical vapor chamber cooling and combine it with heatpipe technology, TPC 812 is prepared to handle the massive heat generated by overclocking and benchmarking. Vertical vapor chamber working in tandem with heatpipes and a specialized heatsink and fin design allow the TPC 812 to outperform the competition.
Related Products
|
Keine Kommentare:
Kommentar veröffentlichen